Bead probe technologyW
Bead probe technology
Boundary scanW
Boundary scan
Chip on boardW
Chip on board
Contact padW
Contact pad
Copper pourW
Copper pour
DepanelingW
Depaneling
DesolderingW
Desoldering
Edge connectorW
Edge connector
Electroless nickel-phosphorus platingW
Electroless nickel-phosphorus plating
Expansion cardW
Expansion card
IPC (electronics)W
IPC (electronics)
MicrostripW
Microstrip
Non functional padW
Non functional pad
ODB++W
ODB++
Planar transmission lineW
Planar transmission line
Printed circuit boardW
Printed circuit board
Printed circuit board millingW
Printed circuit board milling
Reflow solderingW
Reflow soldering
Rigid needle adapterW
Rigid needle adapter
Riser cardW
Riser card
Selective solderingW
Selective soldering
Pick-and-place machineW
Pick-and-place machine
Solder maskW
Solder mask
Tape-automated bondingW
Tape-automated bonding
Teardrop (electronics)W
Teardrop (electronics)
Tempo AutomationW
Tempo Automation
Through-hole technologyW
Through-hole technology
UnimicronW
Unimicron
Wave solderingW
Wave soldering