WBack end of line
WBoundary scan
WChip on board
WCo-fired ceramic
WDip soldering
WDiscrete manufacturing
WEutectic bonding
WFan-out wafer-level packaging
WFront end of line
WFlexible electronics
WFootprint (electronics)
WGerber format
WGold plating
WMordant
WPhotoimageable thick-film technology
WPoint-to-point construction
WPotting (electronics)
WPotting (electronics)
WPressure-tolerant electronics
WPrinted circuit board
WPrinted electronics
WRework (electronics)
WSanmina Corporation
WSMD LED
WSoldering
WSprague Electric
WSubstrate integrated waveguide
WSurface-mount technology
WSustainable electronics
WTempo Automation
WTest point
WThermal copper pillar bump
WThermal profiling
WThick-film technology
WTurret board
WVideoton (company)
WWafer-level packaging
WWEMO
WWhite box (computer hardware)
WWire wrap